An Investigation of the Influence of Intermetallic Compounds on CompressiveCreep of SAC305/Copper Solder Joints by Modeling
The compressive creep deformation of SAC305/copper solder joints is tested at 12.739MPa and different temperatures ranging from 343K to 463K. The experimental results were analyzedby curve fitting with time hardening model incorporated in Abaqus?.The influence of intermetallic compounds on compressive creep deformation was also studied by modeling with the parameters of time hardening model which were derived from curve fitting. The modeling results show that deformability of the solders descends sharply at all temperatures, from 343K to 463K, as the volume ratio of intermetallic compounds layer increases. But the distribution of deformation is much more homogeneous, and the deformability of solders becomes similar at different temperatures when the ratio of IMCs is relatively higher.
Zhiwen Chen Bing An Yiping Wu Changqing Liu Rob Parkin
Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan, China Wolfson School of Mecha Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan, China Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, U
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
322-329
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）