Influence of Substrate on Electrical Conductivity of Isotropic Conductive Adhesive

摘要：

Isotropic conductive adhesive (ICA) is widely used with different kinds of substrates in electronics packaging applications. Therefore it is necessary to understand the influence of electrical conductivity of ICA from substrate. In this work, we investigated the electrical resistivity of ICA on quartz, PCB and glass substrate. The experimental data showed that the in-plane electrical conductivity of ICA on PCB is almost twice that of the glass substrate, while the conductivity of ICA on quartz is also significantly greater than that of glass, under the same curing temperature and with the same bond line thickness (BLT) of ICA. This paper later concludes that thermal conductive adhesive (TCA) on substrate with higher thermal expansion coefficient (CTE) is likely to give better performance. Finally, Finite Element Modeling (FEM) and analysis shows that this phenomenon could be universal to ICA and TCA.

关键词： ICA electrical conductivity FEM, CTE

作者: Zhili Hu Wenhui Du Cong Yue Lilei Ye Zhichao Yuan Johan Liu

作者单位: Key State Laboratory for New Displays & System Applications and SMIT Center, Shanghai University, Bo Key State Laboratory for New Displays & System Applications and SMIT Center, Shanghai University, Bo SMIT Ltd Co, No 101 of New Science and Technology Building, Science Park, No 149, Yan Chang Road, Sh Key State Laboratory for New Displays & System Applications and SMIT Center, Shanghai University, Bo

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 330-335

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）