Evaluations of Low Temperature Bonding Using Au Sub-micron Particles for Wafer Level MEMS Packaging
This paper describes wafer level vacuum packaging with sub-micron Au particles for MEMS (micro electro mechanical systems) applications. Low temperature bonding is indispensable for relevant MEMS packaging, and use of sub-micron Au particles are suitable for hermetic seal bonding. For the fabrication of hermetically sealed wafer level packaging, a base silicon wafer and a cap glass wafer were bonded at around 200°C. Before bonding, the surface of seal rings was observed with a laser microscope to investigate the effect of surface roughness for hermeticity. After bonding, bonded wafers were dipped in the hydrofluoroether for 30 min. As a result, surface flatness of Au particles contributed to achieve hermetic sealing. Double seal rings structures were also useful to realize hermetic sealing.
S. Ito T. Ogashiwa Y. Kanehira H. Ishida S. Shoji J. Mizuno
WasedaUniversity, 3-4-lOkubo, Shinjuku-ku, Tokyo, 169-8555 Japan Tanaka Kikinzoku Kogyo K.K., 2-73 Shinmachi, Hiratsuka, Kanagawa, 254-0076 Japan SUSS MicroTec KK, 1-18-2 Hakusan, Midori-ku, Yokohama, Kanagawa, 226-0006 Japan
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
342-347
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）