A New Package Structure with Power Stacked-die Multi-row Lead and process flow

摘要：

SIP (System in Package), enhanced power capability and high I/O count are three technological trends of semiconductor packaging. Power Stacked-die Multi-row Lead package could synthesize these three advanced features into one single package by utilizing the stacked-die structure, Al wires and multi-row leads. The manufacturing process flow consists of twice die bonding, wire bonding, molding and lead trimming and forming processes. This paper will also analyze the potential issues of manufacturing process and propose the corresponding solutions.

作者: Shunan Qiu Fei Zong Tian Jiang

作者单位: Freescale Semiconductor (China) Ltd.No. 15, Xinghua Avenue, Xiqing Economic Development Area, Tianjin, China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 354-359

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）