Progress on thermally conductive adhesive for electronic packaging
Introduction In recent years, with the rapid development of large scale integrated circuit and micro-packaging technology, the electronic components and devices tend to be high miniaturization and intensity. The heat dissipation of electronic components has become more crucial to the overall system because it affects the lifetime, performance and reliability of electronic device. According to survey, the reliability of electronic components decrease byl0％ with the temperature increase by 2°C|2. Heat dissipation from microelectronics is most commonly performed by thermal conduction. For this purpose, most of metal materials are used due to their good thermal conductivity, but they have some disadvantages, such as high density, complicated processing technology and poor resistance to corrosion3. So many researchers direct their interest to the study of thermal conductive adhesives (TCAs). As we all know, polymer matrix have low heat conductivity, so how to improve the thermal conductivity of TCAs has aroused more and more researchers attention. In this paper, the thermal conducting mechanism and heat transfer model were introduced. In addition, its demonstrated in detail that the recent research advances in heat conductive adhesive in the field of fixation and packaging of electronic devices. And then the factors affecting thermal conductivity and methods of enhancing thermal conducting were presented, such as exploiting new filler, modifying the surface of filler and optimizing the technological conditions. Meanwhile, the direction of further development of thermal conductive adhesive in the field of electronics was pointed out.
Xibing Zhan Tianpeng Jin Junying Zhang Jue Cheng
Laboratory of Adhesives and In-situ Polymerization Technology,Beijing University of Chemical Technol Laboratory of Adhesives and In-situ Polymerization Technology,Beijing University of Chemical Technol
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
383-386
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）