A Novel Four Layers Package-On-Package Stacking Technique
Currently,the multilayer Package-on-Package (PoP) stacking technique as the mainstream 3D vertical packaging solution is extensively applied in the manufacture process of portable electronic instruments. While the warpages on the packages caused by the mismatch of the Coefficient of Thermal Expansion (CTE) and stiffness during the assembly and stacking processes are seriously threaten to the stability and reliability. In this paper, a novel four layers PoP stacking technique in which the number of memory die packaged are increased to twice of the traditional two layers PoP is presented. The metal cylinders with stable CTE are placed between the neighboring layers to reduce the warpages on the packages. The high memory density and excellent reliability could meet the requirements of the miniaturization and lightening of the portable instruments.
SHILingfeng XIAO Yuanming ZHANG Ke JIAJun LIU Chen LAI Xinquan
Institute of Electronic CAD, Xidian University, Xian, Shaanxi 710071, China China Electronics Technology Group Corporation No.54 Research Institute, Shijiazhuang, Hebei 050081, Key Lab of High-Speed Circuit Design and EMC, Ministry of Education, Xidian University, Xian,Shaanx
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
399-402
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）