Preparation of Copper Clad Laminates with High Performance Bismaleimide-based Copolymer Matrix Resins
4,4-Diphenyl Bismaleimide/Diallyl Bisphenol A/Bisphenol-A Cyanate Ester/Epoxy Resin copolymer matrix resins were developed by fusion prepolymerization and solution prepolymerization method, and use the bismaleimide (BMI)-based copolymer matrix resins/glass fabric prepared for copper clad laminates, which illustrate Tg at 230.7°C, dielectric constant at 3.57(lMHz) and dielectric loss constant at 0.0053(1 MHz), volume resistivity at 2.3×1013Ω.cm and surface resistivity at 2.4×1015Ω, thermal expansion coefficient at l.lxl05/° C(x y-axis) and 5.7x10-5/°C(z-axis), dip soldering of resistance (288°C) is more than 62s, peel strength at 16.7N/cm, flexural strength at 458.3MP, moisture absorption at 0.19％, the test results explain that the performance is better than Japanese product copper clad laminates with bismaleimide/triazine-based resin(BT resin).
bismaleimide-based copolymer matrix resins thermal expansion coefficient heat resistance dielectric properties mechanical properties copper clad laminate
Hongfu Zhou Jianbin Wang
Yantai Darbond Electronic Materials Co.,Ltd No.98 Jinshajiang Road, Economic Technical Development Zone, Yantai, Shangdong, China 264006
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
410-413
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）