The reliability investigation of capacitors embedded PCB
The reliability of the MLCC embedded PCB with Cufilled via method was investigated and the finite element method (FEM) was conducted to simulate the stress distribution in the PCB. Due to the nonsymmetrical of the MLCC embedded PCB and the CTE mismatch between the materials for the embedded PCB, all samples are non-flatness after test. For the PCB tested at Pb-free reflow, no failure could be observed until it was tested for 9 cycles, voids at the interface between the MLCC and the adhesive were observed. Failures were detected by the LCR tester when the PCB tested at thermal stress condition for 6 cycles and big delamination occurred between the component and the BT material. For the PCB tested at thermal cycling condition, no failure was observed even the samples tested for 1000 cycles. The FEM simulation results showed that the stress accumulated at the interface between the component and the BT material. When the ambient temperature reached 288 oC, it is as high as 0.610 Gpa which leads to the delamination of the MLCC embedded PCB.
Qinwei Peng Xin Gu Pinghua Bao Dali Huang Jianchao Zhang Lingwen Kong Jian Cai
Shennan Circuits Co, Ltd. Gao Qiao Industrial Park East, Long Gang District, Shenzhen 518117, China Shennan Circuits Co,Ltd. Gao Qiao Industrial Park East, Long Gang District, Shenzhen 518117, China Institute of Microelectronics, Tsinghua University, Beijing, China
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
428-432
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）