Fluidic aligned, dense SWNTs arrays as potential die adhesive and thermal interface material
A simple, room temperature process was reported to fluidic assemble dense, vertically aligned SWNTs between two chips and connect them together. This technology has the potential capability to attach a die to its heat sink in packaging replacing the common available die adhesives by virtue of better mechanical and thermal properties. Two chips with trench about 2 urn deep on the pre-treated surface were pressed together face to face, and SWNT aqueous solution was driven into the gap between the two chips by capillary force. SWNTs beams were found to be assembled and have their two ends bonding with the two chips simultaneously. The mechanism of this phenomenon was explored experimentally and theoretically. In further, a series of experiments with different process parameters like different solution concentration, different dimensions of the trenches, multiply dipping and baking cycles were implemented, and the shear strength between the two chips with these different processing parameters was measured after removing moisture completely. In result, shear strength up to about 100 kPa was demonstrated.
Hao Rong Baoming Wang Miao Lu
Pen-Tung Sah Micro-Nano technology Institute, Xiamen University Xiamen, China, 361005
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
440-445
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）