The Analysis of Measurement Methods for High Power LED Thermal Resistance

摘要：

With the development of high power LED technology, junction temperature as a key factor constrains the performance and the service life of LED, and the main parameter of junction temperature is thermal resistance. Therefore, how to measure the thermal resistance of high power LED quickly and accurately plays an important part in improving the performance and the service life of LED. Based on the study of high power LED thermal resistance and its basic measurement principle, this paper provides an analysis of the different measurement methods for thermal resistance, including of infrared thermal imaging method, spectra method, electrical parameters method, and so on, then compares and analyses their merits and shortcomings, applicable areas and improvement measures that provide the reliable basis for measuring the thermal resistance of high power LED.

关键词： high power LED thermal resistance junction temperature

作者: Hongmin Wang Jing Dong Zhili Liu Bingru Liang

作者单位: Harbin University of Science and Technology,Harbin,China

会议类型: 国际会议

会议名称: The 6th International Forum on Strategic Technology(IFOST 2011)(第六届国际战略技术论坛)

会议地点: 哈尔滨

会议语种:英文

页码: 867-870

在线出版日期: 2011-08-22（万方平台首次上网日期，不代表论文的发表时间）