The Design Research of Single-Chip High Power LED Radiator

摘要：

As new generation of solid-state lighting source with green environmental protection, White LED has become the focus of attentions. Along with the development of high power LED, heat dissipation problems of LED become more and more important. This paper makes research on single-chip high power LED by ANSYS finite element software, and analyzes the thermal effects of parameters on the radiator. This paper believes that the influence of radiator materials thermal conductivity is not obvious, and the finned height and cooling area of radiator play an very important role in reducing chip junction temperature.

关键词： Thermal resistance radiator High power LED ANSYS

作者: LUO Yuan WEI Tiwei TANG Zhengwei KONG Weixi

作者单位: Chongqing University of Posts and Telecommunications, Chongqing 400065, P.R.China

会议类型: 国际会议

会议名称: The 3th International Conference on Precision Instrumentation and Measurement 2011(CPIM2011)(第三届精密仪器与测量国际学术会议)

会议地点: 湘潭

会议语种:英文

页码: 219-224

在线出版日期: 2011-07-19（万方平台首次上网日期，不代表论文的发表时间）