Study of self-heating and mutual thermal coupling resistance in power HBTs with non-uniform finger spacing
The thermal resistance matrix of multi-finger power HBT including self-heating thermal resistance and mutual thermal coupling resistance is presented to describe the improvement mechanism of non-uniform finger spacing technology. It is shown in the thermal network of multi-finger power HBT that the finger temperature depends on the value of thermal resistance matrix. For HBT with non-uniform finger spacing, the values of mutual thermal resistance decreases markedly as center finger spacing increases, which could effectively lower the center finger temperature. At the same time, the outside finger spacing increases moderately to maintain the total finger spacing of the device constant. As a result, the mutual thermal coupling resistance of outside fingers increased, and results in a slight temperature rise of the outside fingers. Therefore, the non-uniformity of the finger temperature profile is also improved effectively.
D. Y. Jin W. R. Zhang Q. Fu L. Chen Y. Xiao R. Q. Wang X. Zhao H. Y. Xie
College of Electronic Information and Control Engineering Beijing University of Technology Beijing, 100124, China
国际会议
2011 China-Japan Joint Microwave Conference(2011年中日微波会议CJMW 2011)
杭州
英文
447-450
2011-04-20（万方平台首次上网日期，不代表论文的发表时间）