A pilot study on the Relationship between Mechanical and Electrical Loss Tangents of Glass Powder Reinforced Epoxy Composites Post-cured in Microwaves
The mechanical and thermal properties of hollow glass powder reinforced epoxy resin composites have been measured and evaluated in earlier studies. This basic but critical and important data have caused interests in the relevant industry in Australia. This study is therefore carried out to measure and evaluate the dielectric properties of the composites with a view to benefit the relevant industry. The relationship between the dielectric and thermal properties will also be studied and correlated. The original contributions of this paper are that samples postcured in conventional ovens have higher electrical as well as mechanical loss tangent values than their counterparts cured in microwaves only. The storage modulus of all samples post-cured conventionally is higher than its counterpart. This is in line with the fact that they are softer material with lower glass transition temperatures. For all percentages by weight of glass powder, the glass transition temperature for the microwave cured sample was higher and the composite was stiffer; the opposite was true for the conventionally cured samples.
Epoxy resin hollow glass powder dielectric loss tangent mechanical loss tangent glass transition temperature and storage modulus
H Ku P Wong A Maxwell J Huang H Fung T Mohan
Faculty of Engineering and Surveying,University of Southern Queensland,West Street,Toowoomba,4350,Australia
国际会议
the 2011 International Conference on Key Engineering Materials(ICKEM 2011)(2011关键工程材料国际会议)
三亚
英文
26-30
2011-03-25(万方平台首次上网日期,不代表论文的发表时间)