The design of a vector hydrophones chip-level damping structure
A novel damping spring structure is designed based on the existing structure of MEMS vector hydrophone. It is desirable that this novel structure can improve the antinoise ability of hydrophone. According to finite element simulation by Ansys, the geometry, stiffness and location of the spring are determined. Two pairs of spring are adopted and placed inside and outside vertically. Simulation results show that the reducing flow noise ability of this damping structure can be increased by 3 times, as well as it does not affect the sensitivity of hydrophone. The advantages of this chip-level spring damping structure are one integrated, good consistency and engineering applications.
spring damping coefficient of stiffness Vector hydrophone
Xibao Liu Guojun Zhang Linggang Guan Liangxia Yan Chenyang Xue
Science and Technology on Electronic Test & Measurement Laboratory Key Laboratory of Instrumentation Science and Technology on Electronic Test & Measurement Laboratory
国际会议
上海
英文
358-360
2011-03-11（万方平台首次上网日期，不代表论文的发表时间）