会议专题

The design of a vector hydrophones chip-level damping structure

A novel damping spring structure is designed based on the existing structure of MEMS vector hydrophone. It is desirable that this novel structure can improve the antinoise ability of hydrophone. According to finite element simulation by Ansys, the geometry, stiffness and location of the spring are determined. Two pairs of spring are adopted and placed inside and outside vertically. Simulation results show that the reducing flow noise ability of this damping structure can be increased by 3 times, as well as it does not affect the sensitivity of hydrophone. The advantages of this chip-level spring damping structure are one integrated, good consistency and engineering applications.

spring damping coefficient of stiffness Vector hydrophone

Xibao Liu Guojun Zhang Linggang Guan Liangxia Yan Chenyang Xue

Science and Technology on Electronic Test & Measurement Laboratory Key Laboratory of Instrumentation Science and Technology on Electronic Test & Measurement Laboratory

国际会议

2011 3rd IEEE International Conference on Computer Research and Development(ICCRD 2011)(2011第三届计算机研究与发展国际会议)

上海

英文

358-360

2011-03-11(万方平台首次上网日期,不代表论文的发表时间)