Test structures design and realized of Standard Interconnect Performance Parameters in nano technology

摘要：

Standard Interconnect Performance Parameters (SIPPs) is standard method to measure ultra-large scale integrated circuit Back-End-Of-Line (BEOL) performance. Combination with nano-technology BEOL features, Designed parallel plate, layer-skipping parallel plate, comb meander, comb meander for via resistance test structures to extract SIPPs according to their sensitivity differences to different test structures, and realized them in CIF format file with High-level Perl language automatically combined with layout layer information and test structures input file. Then change to GDSII format file that wafer used widely by Cadence layout software, and pass electrical rule checks. Greatly improved the efficiency of test structures design and realized. Lay the foundations for formulation of Design for Manufacturability physical design rules and further research interconnection statistical models under nano technology with more unique physical phenomena.

关键词： Interconnect SIPPs parameters Test structures Design Automatically realized

作者: Yonghong Zhang Rui Huang

作者单位: Practicing and Training Center,Shanghai Second Polytechnic University,Shanghai,China

会议类型: 国际会议

会议名称: 2011 3rd International Conference on Computer and Network Technology(ICCNT 2011)(2011第三届IEEE计算机与网络技术国际会议)

会议地点: 太原

会议语种:英文

页码: 364-367

在线出版日期: 2011-02-26（万方平台首次上网日期，不代表论文的发表时间）