会议专题

A New Method for Calculating the Copper Coverage of PCB

This paper introduces a new method to obtain the copper coverage of PCB. Board-level simulation is very important in the thermal analysis and reliability design of electronic equipment. While in the process of PCB modeling, it is difficult to obtain the coverage percentage of copper in the PCB layer. By this method, the calculation of the coverage is convened to MATLAB image processing problems, is more simple than the traditional methods and the precision is higher, with strong practical.

thermal analysis thermal design reliability copper coverage PCB

Min Jiang Cheng Gao Jiao-ying Huang Gui-cui Fu Ying Chen

School of Reliability and Systems Engineering,Beijing University of Aeronautics & Astronautics,Beijing,China

国际会议

2011 3rd International Conference on Computer and Network Technology(ICCNT 2011)(2011第三届IEEE计算机与网络技术国际会议)

太原

英文

304-307

2011-02-26(万方平台首次上网日期,不代表论文的发表时间)