Research On Gold Wire Bonder Chip Identification Algorithm and Its Application
Automatic gold wire bonder is an important equipment of IC package.Fast chip identification and solder coordinate rebuilding is its core technology.At the aspect of algorithms of chip identification and solder coordinate,reconstruction,sequential similarity detection algorithm (SSDA) of template matching has been improved and its implementation has been realized in this paper.The improved algorithm achieved the chip image recognition and positioning of spot position through four steps which were establishing templates,coarse matching,calculating correlation coefficient of subgraph and precise matching.Practice has proved that the algorithm can satisfy the real time requirement (<50ms),and have high accuracy.
automatic gold wire bonder image matching the correlation coefficient
Xianming Xiong Haibo Tan
Electronic Engineering and Automation College,Guilin University of Electronic Technology Guilin Guangxi,China
国际会议
太原
英文
58-61
2011-02-26（万方平台首次上网日期，不代表论文的发表时间）