Modeling and analysis of effect of thermal exposure on fatigue crack growth of Al-Cu-Mg alloys with low Cu/Mg ratio

摘要：

Effect of thermal exposure on FCG of Al-Cu-Mg alloys with low Cu/Mg ratio in artificial and natural ageing conditions were modeled and analyzed. Three FCG rate models, namely Collipriest, Priddle, and Modified Forman model were examined to research the effect of thermal exposure on FCG of Al-Cu-Mg alloys with low Cu/Mg ratio in artificial and natural ageing conditions. The results showed that Priddle model provided the best fit. Priddle model was used to fit FCG data of (a) 170°C/30min ageing; (b)170°C/30min ageing + 100°C/2000h exposure; (c)T351 ageing+100°C/2000h exposure; (d) T351 ageing. The fitted results indicated that the FCP resistance can be increased by slight artificial aging, and artificial aging can delay the degradation of the fatigue properties

关键词： fatigue crack growth Collipriest Priddle Forman thermal exposure

作者: Yanhui Hou zhiyi Liu Yanbin Liu

作者单位: Key Laboratory for Ferrous Metallurgy and Resources Utilization of Ministry of Education,Wuhan U Key Laboratory of Nonferrous Metal Materials Science and Engineering,Ministry of Education,Central S

会议类型: 国际会议

会议名称: 2011 International Conference on Advanced Material Research(ICAMR 2011)(2011年先进材料研究国际会议)

会议地点: 重庆

会议语种:英文

页码: 111-115

在线出版日期: 2011-01-21（万方平台首次上网日期，不代表论文的发表时间）