Influence of Substrate Material on Tensile Behavior and Fracture Characteristics of SiC by ChemicalVapour Deposition

摘要：

SiC filament was prepared by Chemical Vapour Deposition method using W wire as the substance material. The combination between W wire and SiC became a key element influencing tensile strength of SiC. In this paper, tensile fracture morphology of SiC filament was analyzed, from which interface combination between SiC and W wire was discussed under different deposition temperature and the influence of interface layers thickness on final tensile of SiC filament was given. How to control the thickness of interface layer is a key factor for improving performance of SiC filament.

关键词： SiC filament CVD W wire Fracture characteristics Interface

作者: Cuixia Liu Yanqing Yang Xian Luo

作者单位: School of Materials and Chemical Engineering, Xian Technological University, Xian, 710032,P.R.Chin School of Materials Science and Engineering, Northwestern Polytechnical University,Xian,710072, P.R

会议类型: 国际会议

会议名称: 2011 International Conference on Advanced Material Research(ICAMR 2011)(2011年先进材料研究国际会议)

会议地点: 重庆

会议语种:英文

页码: 272-275

在线出版日期: 2011-01-21（万方平台首次上网日期，不代表论文的发表时间）