Coupled Temperature Field Analysis for Copper Wire/Copper-dipped Carbon Plate under Electric Current
Contact interface temperature is an important factor that effect contact failure of sliding frictional couple. On the basis of the transient heat conduction theory and considering unstable conduction of heat, thermal convection of environment and thermal radiation, under the effect of Joule heat and frictional heat, a transient thermal model for copper wire/copper-dipped carbon panel of pantograph & catenary system was created based on 3D finite element method, which used to simulate what kind of factors can influence temperature rise of friction pairs. The distribution and features of the transient temperature field to plates were obtained as it working in normal operation, and the analysis results were compared with test data. The results show that within the limits of experimental error, the results of simulation can be in accordance with experiment conclusion. Electric current, velocity and normal force are the main factors which can influence the temperature rise. The coupled temperatures change with different electric currents and velocities were further studied, and under the constant displacement and normal force, the maximum coupled temperature increases with the increase of electric current and velocity; under the constant electric current and velocity, with the increase of normal force, the maximum coupled temperature decreases and then increases in the shape of
Chen Zhonghua Li Benjun Guo Fengyi
Liaoning Technical University, Huludao, China
国际会议
西安
英文
612-616
2011-10-23（万方平台首次上网日期，不代表论文的发表时间）