Parameter Analysis of Hot Plate in Lithography Process Based on Regression Orthogonal Experiment Design

摘要：

In lithography process, wafers need to be baked on the hot plate. There are very high requirement to the temperature uniformity of hot plate surface. To the problem of choosing design parameters, the orthogonal experimental design method was used, the simulation software ANSYS was applied, the design parameters on the various conditions were analyzed, Then a regression model was obtained based these simulation data. It is consistent between the result of regression model and the result of simulation. The regression model indicates a better choice direction of the design parameters of hot plate.

作者: Jing-zhen WANG Wei-jun LIU

作者单位: Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China Graduate School of th Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China

会议类型: 国际会议

会议名称: 2011 IEEE 18th International Conference on Industrial Engineering and Engineering Management(2011 IEEE 第十八届工业工程与工程管理国际会议 IEEM2011)

会议地点: 长春

会议语种:英文

页码: 1717-1720

在线出版日期: 2011-09-03（万方平台首次上网日期，不代表论文的发表时间）