Hybrid FIB/SEM/SPM System Used for In-situ Analysis of Milling Process on Metallic Thin Films
A novel tool for nanofabrication combining focused ion beam (FIB) technology, scanning electron microscopy (SEM) and scanning probe microscopy (SPM) has been used to study effects of ion beam-solid interactions. This unique system enables in-situ nano-patterning and subsequent inspection of the created structures. The advantage of measurements in such an apparatus is that samples are not degraded by contamination or oxidation at the atmospheric air. In this paper, we demonstrate the capabilities of this system by nano-patterning metallic thin film layers designed for spintronic applications. We investigated the milling process and the influence of FIB milling parameters (dwell time and incidence angle) on the surface roughness. It was found that the main reasons for increased roughness are different sputter yields for various crystallographic orientations of the grains in a polycrystalline metallic film. We determined the minimum ion dose necessary to mill through the whole thin film up to the silicon substrate and we observed that the oblique ion beam angle and long dwell time are favorable parameters for suppression of the intrinsic roughness.
Zdeněk Král Jaroslav Jirule Eva Kolíbalová
TESCAN, a.s., Libu?ina tlída 21, 623 00 Brno, Czech Republic
国际会议
长春
英文
1-5
2011-08-29（万方平台首次上网日期，不代表论文的发表时间）