Fiber-Waveguide Coupling Allignment with Intergrated Shape- Memory Alloy Thin Film Technique

摘要：

Directly butt-coupled technique for fiber-chip coupling presents 7~10dB power loss, due to the highly unequal spot-sizes associated with each device. According to the expense of resultant sub-micron alignment tolerance, a novel application of integrated Shape-Memory Alloy (SMA) thin film technique were introduced and simulation was perfomed to improve the coupling efficiency. between single mode fiber(SMF) with fiber ended microlens (FEML) and waveguide. An application design is also illustrated and presented in details. One kind of SMA thin film cluster architecture prototype is defined as basic alignment function block integrated on silicon substrate. With a reference alignment solution, alignment feedback and control are also considered

作者: ZHU Jingping CHEN Yaohui LI Jie ZHANG Yunyao

作者单位: Key Laboratory for Physical Electronics and Devices of the Ministry of Education & Shaanxi Key Lab of Information Photonic Technique, Xian Jiaotong University, Xian, PR China

会议类型: 国际会议

会议名称: The First International Conference on Manipulation,Manufacturing and Measurement on the Nanoscale(第一届3M-NANO国际会议)

会议地点: 长春

会议语种:英文

页码: 1-3

在线出版日期: 2011-08-29（万方平台首次上网日期，不代表论文的发表时间）