Transient Liquid Phase Bonding of Cu-based MicroChannel Devices
Proper bonding and assembly techniques are essential for fabrication of functional metal-based microdevices. In this paper, Cu-based microchannel structures have been successfully bonded with a transient liquid phase (TLP) technique using thin Al foil intermediate layers. Structure of the Cu/Al/Cu bonding interface region was examined in detail with conventional and focused ion beam (FIB) sectioning, scanning electron microscopy (SEM), transmission electron microscopy (TEM), and X-ray energy dispersive spectroscopy (EDS). Tensile fracture tests were conducted on TLP bonded Cu/Al/Cu coupon assemblies, the results of which were correlated to the structure of the bonding interface region. The present , results highlight the importance of tuning the TLP bonding protocol to achieve the desired structure of the bonding interface region and consequently the optimal mechanical property for the bonded structure or device.
Ke CHEN W.J.MENG Fanghua MEI
Mechanical Engineering Department, Louisiana State University, Baton Rouge, LA70803, U.S.A. Enervana Technologies LLC, Baton Rouge, Louisiana 70820, U.S.A.
国际会议
The 4th International Conference on Mechanical Engineering and Mechanics(第四届国际机械工程与力学会议)
苏州
英文
755-760
2011-08-11（万方平台首次上网日期，不代表论文的发表时间）