Trends in MEMS Packaging

摘要：

This presentation will provide an overview of the development of MEMS packaging technologies and our recent work in development of new packaging methods for wafer level packaging and/or 3D packaging of MEMS and sensors. MEMS devices are made of micromechanical structures and offer numerous functionalities. They offer superior performance and small footprint in many applications as compared to their conventional counterparts. After the successful application of MEMS in the automotive industry and in industrial control and instrumentation, MEMS are being integrated in portable devices and systems, for example MEMS microphones in mobile phones and laptops. The presentation will look at the development of bonding methods for encapsulation and interconnection methods that have enabled successful manufacture of MEMS devices. Future trends in MEMS packaging will be discussed together with the emerging methods and requirements for MEMS manufacture.

作者: C.H.WANG

作者单位: Heriot-Watt University, UK

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 1

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）