COTS Components for High Reliability Applications
This presentation will focus on predictive reliability of COTS components for high reliability applications in sectors such as aerospace and defence. Reliability assessment of newly designed electronic products before their actual manufacture is a critical issue for many organisations including those involved in the aerospace industry. The products manufactured by the aerospace industry operate in extreme in-service environments and normally require very high reliability qualification (e.g. 25-30 years). The limited availability of MiL-Spec components is forcing a number of high reliability markets, including aerospace, to consider the use of commercial-off-the-shelf (COTS) electronic components. Many of the COTS components including BGA packages have not been designed for such high reliability applications. Therefore, characterizing the behaviour of these components in high reliability applications and assessing their reliability and life-time is a very important task. The Finite Element Method (FEM) is the common numerical approach used to predict the stress and strain state in electronic assemblies. In a reliability analysis it is crucial to identify the failure mode and to relate the FEM predictions to quantities that characterise the damage leading to product failure and to use this to predict life-time. Ultimately, the results can be used to optimise the design or the conditions of the process with respect to certain criteria. This presentation details the issues faced by high reliability applications of COTS components such as Tin Whiskers and approaches adopted to mitigate these failures. Also a number of examples will be provided on predicting the reliability of COTS components for aerospace applications and how modelling can help optimise packaging to help ruggedize COTS components.
Chris BAILEY
University of Greenwich, UK
国际会议
上海
英文
1
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）