Effect of Interfacial Reaction on Reliability of Flip Chip Lead-free Solder Joints
With the continuous miniaturization of electronic products, the solder joints used to join chips and substrates are downsizing but the electric current in ultra fine solder joints are increasing. As a result, the interfacial intermetallic compound (IMC) layer played a critical role on the reliability of the ultra fine solder joint. In this paper, the solid/liquid reaction the effect of solder volume on the liquid/solid interfacial reaction was convincingly demonstrated, i.e., the smaller the solder ball is, the larger the IMC grains are, and the thicker the interfacial IMC is. It is indicated that with the continuous miniaturization of packages the reliability of ultra fine solder joints becomes more serious since the thicker brittle IMCs deteriorate the integrity of solder joints. The current-induced interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu(OSP) and Ni/Sn-3.0Ag-0.5Cu-/Au/Pd(P)/Ni-P(ENEPIG) flip chip interconnects and the failure mechanisms during electromigration (EM) were reported. The failure mechanisms of sub-50 micron flip chip lead-free solder joints under shear tests were analyzed. The liquid/solid and solid/solid interfacial reactions and interfacial IMC growth kinetics were investigated in order to identify the correlation between the failure modes and the metallurgical characteristics in sub-50 micron flip chip solder joints.
Mingliang HUANG
Dalian University of Technology, China
国际会议
上海
英文
1
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）