Design and Fabrication of a TSV Interposer for SRAM Integration

摘要：

TSV interposer provides a cost efficient solution way for 3D IC integration. In this paper, a TSV interposer technology is proposed for SRAM stacking. A simple fabrication process is developed for cost-sensitive application. The mushroom-like Cu/Sn bumps by copper overburden can be directly connected with other substrate, which eliminates a CMP planarization to improve the yield and reduce fabrication cost. The electrical and thermal-mechanical behaviors of the 3D system were analyzed. Preliminary fabrication results are demonstrated. The TSV interposer technology is promising for 3D SRAM integration.

作者: Yunhui ZHU Min MIAO Yufeng JIN Shenglin MA Qinghu CUI Wenping KANG Zhiyuan ZHU Xin SUN Guanjiang WANG Mengmeng ZHANG Jing CHEN

作者单位: National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beij National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beij National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beij

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 36-39

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）