Low Temperature Thermocompression Bonding Based on Copper Nanostructure for 3D Packaging
Cu-Cu thermocompression bonding has become an important technology for 3D packaging and integration. In this paper, a novel low temperature thermocompression bonding technology using nanostructure Cu layer was presented. By selective dealloying of Cu-Zn alloy in dilute hydrochloric acid, porous nanostructure Cu layer was fabricated on silicon substrate. Scanning electron microscopy (SEM) and X-ray fluorescence (XRF) analysis revealed that the dealloying time strongly influenced the nanostructure. Low temperature thermocompression bonding at 280℃ was achieved using the nanostructure Cu layer with no void and bonding interface, bonding strength test showed promising properties compared with that of flat Cu layer.
Mingxian Cai Mingxiang Chen Sheng Liu
School of Mechanical Science and Engineering, HUST, Wuhan, China, 430074 School of Mechanical Science and Engineering, HUST, Wuhan, China, 430074Division of MOEMS, Wuhan Nat School of Mechanical Science and Engineering, HUST, Wuhan, China, 430074 Division of MOEMS, Wuhan Na
国际会议
上海
英文
57-60
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）