Electrical Characterization of Cylindrical and Annular TSV for Combined Application Thereof

摘要：

In this paper, the potential application of combining cylindrical TSV and annular TSV into 3D integration was studied. First, the schematic fabrication process of cylindrical and annular TSV was proposed. Lumped equivalent circuit model of these different kinds of TSV structures from the physical configuration were studied and verified. Besides, 3D full wave electromagnetic (EM) simulations of cylindrical TSVs and annular TSVs were performed to verify the proposed lumped model of TSV.

作者: Xin Sun Qinghu Cui Yunhui Zhu Zhiyuan Zhu Min Miao Jing Chen Yufeng Jin

作者单位: Institute of Microelectronics, Peking University, Beijing, 100871, P.R.China Institute of Microelectronics, Peking University, Beijing, 100871, P.R.China Peking University Shenz Institute of Microelectronics, Peking University, Beijing, 100871, P.R.China Information Microsystem Institute of Microelectronics, Peking University, Beijing, 100871, P.R.China Peking University Shen

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 76-80

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）