Wafer Level Vacuum Packaging for MEMS Device by Solder Sealing

摘要：

Wafer level vacuum packaging is an emerging method to offer a hermetic cavity for MEMS devices with the smaller size and the lower cost, and is expected to be a new generation packaging technology of mass production to substitute the traditional metallic packaging and ceramic packaging. Solder bonding in a vacuum oven was employed in this work to achieve a Chip-to-Wafer (C2W) vacuum bonding for MEMS device. The results showed that the hermeticity of the samples met the requirements of MIL-STD-883. Effects of the process parameters such as the solder layer thickness, the soaking time of reflow, and the bonding pressure on bonding quality were investigated and optimized.

作者: Bing An Gan-ran Tang Ya-nan Sun Wei-wen Lu Yi-ping Wu

作者单位: School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China, 430074 Wuhan National Laboratory for Optoelectronics, Wuhan, China, 430074

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 121-124

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）