The Flip Chip market and supply chain are being reshaped by new requirements and technologies

摘要：

Flip chip technology certainly isn’t new, but its not considered mature yet either. It was originally created by IBM in the 1960s and, due to its high cost, has been primarily reserved for high-performance applications. Until relatively recently, nearly all packages relied on wire bonding. Now, flip chips are taking over.

作者: Lionel Cadix Jean-Marc Yannou Christophe Zinc

作者单位: Yole Développement 45 rue Sainte Geneviève, 69006 Lyon

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 145-146

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）