Preparation and Microstructure of Functionally Gradient Diamond/SAC Composite Solder Bumps
With the method of copper-coating 100μm Diamonds was added into Sn3.0Ag0.5Cu(SAC305) solder to acquire Diamond/SAC305 composite solder bumps on Cu pad, which is considered to be a potential material to improve the thermal management of HB-LEDs, on account of the favorable conducting property of diamonds. Not only was a relatively high (7 wt. %) and controllable addition amount of diamonds achieved, but also a much better outlook of the solder bumps was observed. Whats more, spreading areas of the new solder were calculated and shear strengths of the bumps were measured. Spreading area went up and down respectively before and after the diamond additions was 3wt%. Meanwhile the shear strength fluctuated with peaks at 1wt% and 7wt%. The distribution of diamonds was observed as centralizing mainly at the interface between the solder and the Cu pad, making up a special enhanced interface character as a kind of functionally gradient (FG) solder bump.
Zhong Ying Zhang Wei Wang Chunqing Wang Chunyu Li Bin
National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, N School of Material Science and Engineering, Harbin Institute of Technology(Weihai), No.2, West Wenhu
国际会议
上海
英文
178-182
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）