Retarding Electromigration on the Sn-Ag-Cu Solder Joints by Micro-Sized Metal-Particle Reinforcement

摘要：

Electromigration (EM) has become one of the reliability concerns to the fine pitch solder joint due to its increasing capacity to bear the high current density The EM effects on microstructure evolution of Sn-3.0Ag-0.5Cu+XNi (X=0, 0.05, 0.45, 2.0wt. %) solder joint was investigated. Findings of this study indicated that an appropriate addition of Ni element and moderate ambient temperature can alleviate EM damages in solder joint. The intermetallic compound layer which held a planar type and appropriate thickness improved the resistance of EM effects by suppressing the polarity effect. Ag3Sn and the bulk IMCs also retard the effects from current stressing for the solder joint.

作者: Limin Ma Guangchen Xu Fu Guo Xitao Wang

作者单位: The College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 195-199

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）