Electromigration Behavior in In-situ Cu6Sn5 Reinforced Eutectic SnAg Composite Solder Joints
Due to the excellent resistance to thermal mechanical fatigue and creep resistance properties of in-situ Cu6Sn5 reinforced composite solder, its meaningful to further investigate the Electromigration (EM) behaviors of such novel composite solder. We used in-situ method to prepare Cu6Sn5 reinforced Sn-3.5Ag composite solders, the weight fraction of which was 1 vol.%, 5 vol.%, and 20 vol.%, respectively. A constant electric current was applied to a one-dimensional solder joint which ensures a uniform distribution of current density. For this study, a current density of 104 A/cm2 was applied to solder joints under 75℃. The evolution of interior microstructure due to current stressing effects was observed by using scanning electron microscopy (SEM). The results revealed that after current stressing for 96 and 192 h, no remarkable EM damages exhibited in solder matrix. Whereas, after current stressing for 384 h, 1 vol.% and 20 vol.% Cu6Sn5 reinforced composite solder joints have suffered different degrees of polarity effects.
Xiaoya Wang Mengting Han Liming Ma Guangchen Xu Fu Guo
College of Materials Science and Engineering, Beijing University of Technology
国际会议
上海
英文
211-215
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）