会议专题

Preparation and Properties of Conductive Polymer Doped with Ag-coated Glass Fiber for EMI Shielding

In this study, based on the conductive polymer filled with Ag-coated Cu dendritic powder (ACDP), Ag-coated glass fiber powder (AGFP) was selected as assistant filler to improve the conductive network. The results showed that the volume resistivity reached 0.004Ω·cm when the total fillers were less than 70.6 wt%. The effect of the filler content of the AGFP powder on the conductivity, creep behavior of resistance and piezo-resistivity properties of the conductive polymer was studied. Under constant pressure, the resistance creep behavior of the conductive polymer showed that the volume resistivity decreased nonlinearly with time. When the pressure was applied within 0~2.0MPa, the conductivity variation of the conductive polymer exhibited a positive pressure coefficient of resistance (PPCR). However, the piezoresistance effect could be neglected with increasing filler content and applied pressure. In addition, the reliability of the conductive polymer under aging at 85℃ and 85% relative humidity (RH) in a temperature/humidity chamber was discussed.

Xiaohei Liu Zhidong Xia Bo Yuan Mengke Zhao Fu Guo

Materials Science and Engineering, Beijing University of Technology No.100 Pingleyuan, Chaoyang District, Beijing 100124, P.R.China

国际会议

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

上海

英文

237-241

2011-08-08(万方平台首次上网日期,不代表论文的发表时间)