Preparation And Deposition Process Of Cu/Al Powder In Conductive Polymer For EMI Shielding

摘要：

Copper-aluminum powders were prepared by displacement method in aqueous system at 40℃. Composite powders surface topography was investigated by varying the addition of sodium fluoride (NaF). It was noted that dense and uniform copper coating was obtained when the mass ratio of NaF and aluminum powder was approximate 0.1. The mechanism of copper coating formation was discussed in detail. The deposition process was summarized to four stages, including initial reaction stage, grid formation stage, two-dimensional coating spread stage and final epitaxial growth stage.

作者: Xing Zhang Zhidong Xia Yong Gao Shaofan Zhao

作者单位: Beijing University of Technology 100 Pingle Yuan, Chaoyang District, Beijing 100124

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 242-245

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）