Influence of Nano-TiO2 Reinforcements on the Wettability and Interfacial Reactions of Novel Lead- Free Sn3.5Ag0.5Zn Composite Solder/Cu Solder Joints

摘要：

The influences of intermixing nano-TiO2 particles on the wettability and interfacial reaction of novel lead-free Sn3.5Ag0.5Zn composite solder with Cu substrate were investigated. The wettability of the Sn3.5Ag0.5Zn composite solder alloy was measured by the sessile-drop method under a 10-3 Torr vacuum at different temperature up to 30 mins. Scanning electron microscopy (SEM) was used to quantify the interfacial microstructure for each processing condition. The continuous scallop-type Cu6Sn5 IMC layer was still the only original product at the SAZ solder/Cu and SAZ composite solder/Cu interface at temperature 300 ℃. However, a new flat-type Cu5Zn8 IMC layer was formed at the Cu6Sn5/Cu interface at temperature 325 ℃. The addition of nano-TiO2 particles to the SAZ solder effectively improved in wetting property and corresponding suppressed the growth of the IMC layer at the interface.

作者: L.P.Feng S.Y.Chang L.C.Tsao F.S.Wang

作者单位: Department of Materials Engineering, National Pingtung University of Science &Technology, 91201,Neip Department of Mechanical Engineering, National Yunlin University of Science & Technology, Touliu, Yu Hseuhfu Road, Neipu, Pingtung 91201, Taiwan, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 260-263

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）