The Study on the Shaping of Electroplated Copper Pillar Bumping
With the increasing connection density of ICs, the technology of flip chip packaging and stacked-die packaging bounded by bumping are gradually replacing the traditional wire bonding to become one of the main styles of the package. And as one of the critical technology the technology of electroplating copper pillar wins more and more concern. This paper concerns about the influence of the electroplating additives which includes accelerator, leveler and the density of electroplating current to the forming of copper pillar. And by adjusting the quantity of the additives and the density of electroplating current, we got the satisfactory copper pillar with the smooth surface.
Ying Han Ming Li Hongqi Sun Jiangyan Sun
The State Key Lab of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai The State Key Lab of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai， The Key Labor Shanghai Sin yang Semiconductor Materials Co., Ltd
国际会议
上海
英文
312-315
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）