Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-Ag/Cu Joint

摘要：

The as-soldered microstructures of intermetallic compounds (IMC) in Sn-Ag/Cu joint were investigated under different soldering temperatures and cooling rates. Scalloped, faceted, prismatic and hexagonal shape Cu6Sn5 grains were observed at the solder/Cu interface, respectively. Scalloped shape grains were found at 250℃. At higher soldering temperatures such as 275℃ and 300℃, faceted grains were dominant and the other two were mainly discovered under smaller cooling rates. Simultaneously, large plate-like Ag3Sn formed in virtue of interfacial Cu6Sn5 under furnace cooling, which was discussed based on the solidification sequence.

作者: Liyu Gu Lin Qu Haitao Ma Zhongbing Luo Lai Wang

作者单位: School of Materials Science & Engineering Dalian University of Technology Dalian 116024, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 342-345

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）