High Thermal Conductive BT Resin/Silicon Nitride Composites
In this study, thermally conductive bismaleimide-triazine resin (BT)/silicon nitride (Si3N4) composites have been developed. The effect of Si3N4 particles loading on thermal conductivity, glass transition temperature (Tg) and thermal stability of the composites was investigated. It was found that the BT/Si3N4 composites showed increase in thermal conductivity with Si3N4 weight fraction. The thermal conductivity of the BT/Si3N4 composites was up to 0.94 W/m.K, for a mixture containing 50 wt% of micro Si3N4 fillers in the BT resins matrix, which was about 5 times larger than the pure BT resin. Moreover, the BT/Si3N4 composites had excellent thermal properties. The Tg values were above 180 ℃, and thermal decomposition temperatures were over 370 ℃. The resulting composite with excellent thermal properties can be utilized in high temperature micro-fabrication of heat dissipative components in microelectronic industry.
Xiaoliang Zeng Shuhui Yu Rong Sun Ruxu Du
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China, 518055 Institute of Precision Engineering, The Chinese University of Hong Kong, Shatin, NT, Hong Kong, Chin
国际会议
上海
英文
346-348
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）