Analysis of Cu6Sn5 Grain Orientations in Sn3.0Ag0.5Cu Lead-Free Solder Joints

摘要：

Electron backscatter diffraction (EBSD) technology combined with Orientation Imaging Microscopy (OIM) analysis method were employed to investigate the morphologies and orientations of Cu6Sn5 grains formed between Sn3.0Ag5.0Cu and polycrystalline copper, (001) (111) Cu single crystals under liquid-state condition. The reflow temperature was the main factor that influence the transformation of Cu6Sn5 grains from scallop-type to prismtype. The morphology for. the prism-type Cu6Sn5 grains formed on Cu single crystals arranged regularly, and their orientations had a strong dependence on the Cu substrates, the reason for which is the low misfit leading to the decreasing of surface energy.

作者: Yanhong Tian Lina Niu Chunqing Wang

作者单位: Electronics packaging Lab, School of Materials Science and Engineering, Harbin Institute of Technology 92, Xidazhi Street, Nangang, Harbin, P.R.China, 150001

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 353-356

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）