The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization
Low cost electrodeposited Sn3.5Ag solder bumps fabrication technology was developed for three-dimensional packaging applications. Effect of reflow time on interfacial reaction of electroplated Sn3.5Ag solder bumps with Cu under-bump metallization (UBM) was investigated. The microstructure of eutectic Sn3.5Ag is composed of β-Sn phase and Ag3Sn IMCs in the solder region. At the interface between solder and Cu, scallop-like Cu-Sn IMCs were formed toward solder region and were identified as Cu6Sn5 IMCs by compositional measurement of EDX. XRD measurement identified that Cu6Sn5 and Ag3Sn formed after reflowing for 1min, and as the reflow time extended the quantity of Ag3Sn almost remained the same while the quantity of Cu6Sn5 increased. No Cu3Sn was detected, even after reflowing for 20min. EDX analysis was consistent with the XRD result
Jinglin Bi Anmin Hu Ming Li Dali Mao
Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
国际会议
上海
英文
369-373
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）