Research on SiCp/Cu Composites Preparation and Thixo-Forming Process Simulation
In this paper, SiCp/Cu composite billet was prepared by powder metallurgy and thixoforming process of electronic packaging shell with SiCp/Cu composite was simulated by the finite element software DEFORM-3D. Microstructure of SiCp/Cu composite billet was studied and the results showed that composite billet prepared by powder metallurgy was dense and the combination between SiC particles and Cu matrix was good, which was suitable for electronic packaging shell thixo-forming. The flow velocity field and the effective stress field in the thixo-forming process were simulated and analyzed. The simulation results showed that, SiCp/Cu composite electronic packaging shell with compact structure could be thixo-formed, which could meet electronic packaging shell requirements.
WANG Kaikun SONG Puguang
School of Materials Science and Engineering, University of Science and Technology Beijing 30 Xueyuan Road, Haidian District, Beijing 100083, P.R.China
国际会议
上海
英文
383-386
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）