Design, Fabrication of Through Silicon Vias Based on Suspended Photoresist Thin Film and Its Application in Silicon Interposer
This paper presents a novel fabrication method of through silicon vias (TSVs) based on suspended photoresist thin film. The AZ5214 photoresist thin film is self-assembled on the deionized (DI) water surface, then the film is transferred onto the wafer surface and patterned by photolithography to form the cover plates on the through-vias. After a Cu seed layer is deposited and the photoresist film is chemically removed, the through-vias are filled by Cu electroplating. The process steps, characterization and the feasibility are analyzed in our experiment. According to this approach, one of its applications in silicon interposer is provided and the processes are discussed.
Ziyang Wu Chuanguo Dou Yanhong Wu Heng Yang
State Key Laboratory of Transducer Technology, Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,#800 Yishan Rd.Xuhui District, Shanghai 200233, China
国际会议
上海
英文
400-403
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）