Improvement of Smart Card Mechanical Properties
Smart cards are becoming more and more popular in our daily life for its characteristics of portability and intelligence. Since they are always subject to mechanical pressure during delivering or using, its mechanical performance is very important to guarantee good quality. In this paper, three mechanical pressure tests were introduced to characterize the mechanical performance of COB (Chip on board) of smart card. The test data corresponding to four main factors such as chip thickness, mold thickness, EMC (Epoxy molding compound) types and PMC (Post Mod Cure) was analyzed, it is found that EMC type is the key factor to influence smart card mechanical properties. And it is concluded that the best method to improve smart card mechanical performance is to use the EMC type with high mechanical strength and modulus.
Yi Xiao Jianfeng Zeng Yucai Huang Jonghyun Chae Senyun Kim Myungkee Chung
Samsung Semiconductor (China) R&D Co.Ltd No.15, Jin Ji Hu Road, Suzhou Industrial Park
国际会议
上海
英文
413-418
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）