The Effect of Functionalized Silver on Properties of Conductive Adhesives

摘要：

This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.

作者: Qiong Fan Huiwang Cui Dongsheng Li Zhili Hu Zhichao Yuan Lilei Ye Johan Liu

作者单位: Key Laboratory of Advanced Display and System Applications, Ministry of Education and SMIT Center, S Key Laboratory of Advanced Display and System Applications, Ministry of Education and SMIT Center, S Shang Da Rui Hu Microsystem Integration Technology Co.Ltd, Room 101, Science &Technology Building, S SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology SE-412

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 423-425

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）