Thermal Performance of High Power LED Package Based on LTCC

摘要：

A novel 3D model of LTCC based high power LED package which reduced the package thermal resistance is established. It has quite low junction temperature and thermal resistance Rj-b is only 2.42℃/W. The analysis results reveal that the effect of copper volume and distribution in LTCC board plays a critical role in the heat dissipation of the LED package. Horizontal heat dissipation is also very important except for vertical thermal via. This work demonstrated that High performance LED package based on LTCC substrate can be obtained by optimizing the metallization structure of LTCC substrate or improve the thermal conductivity of LTCC material.

作者: Mingsheng Ma Zhifu Liu Yongxiang Li

作者单位: The Key Laboratory of Inorganic Functional Materials and Devices,Shanghai Institute of Ceramics, Chi The Key Laboratory of Inorganic Functional Materials and Devices,Shanghai Institute of Ceramics, Chi The Key Laboratory of Inorganic Functional Materials and Devices, Shanghai Institute of Ceramics, Ch

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 441-444

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）