A Novel Wirebond-BGA CPU Package

摘要：

The evolution of microprocessor packaging continues to be driven by ever increasing performance, economics and different market segment requirements. CPU evolution in performance/cost is driving the packaging technology continuously. Institute of Microelectronics, Chinese Academy of Sciences has implemented the CPU packaging in 2010. The fabricated package meets all the requirements by Loongson Company, and becomes the first fully domestically packaged CPU in China.

作者: Wang Qidong Cao Liqiang Li Jun Zhang Jin Guidotti Daniel Wan Lixi

作者单位: Institute of Microelectronics Chinese Academy of Sciences No.3, BeiTuCheng West Road, Chaoyang distr Loongson, Beijing Georgia Institute of Technology, Atlanta, USA

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 453-457

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）