Study of Joule Heating Effects in Lead-Free Solder Joints under Electromigration

摘要：

Basic understanding of heating conduction in lead-free solder joints due to the Joule heating effect was carried out by using the infrared (IR) microscopy. In order to interpret the corresponding mechanism and provide a better understanding to Electromigration (EM) studies, a newly developed 1D solder joint with same cross-sectional area in solder alloy and Cu electrodes was employed in our thermal imaging analysis. Both eutectic SnBi and SnAgCu solder alloy were used to fabricate the joints due to their distinct electrical resistivity and thermal conductivity. Various electrical current inputs combined with joints’ thickness of 500 μm were investigated. Accordingly, transient and steady-state heat conduction were identified and compared with different experimental conditions.

作者: Guangchen Xu Fu Guo Andre Lee K.N.Subramanian Neil Wright

作者单位: College of Materials Science and Engineering, Beijing University of Technology Dept.of Chemical Engineering and Materials Science, Michigan State University Dept.of Mechanical Engineering, Michigan State University

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 464-467

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）